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PRODUCTS
Our company has established "multi-layer ceramic package housing
development and production line"
Electronic ceramic products for communication
Electronic ceramics products for industrial laser
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basic information
| Model | Packaging type |
Unit size （mm） |
Thickness dimension （mm） |
Array size （mm） |
Material | Plating layer |
| SWP1814 | CSP package | 1.8×1.4 | 0.16 | 95max（Customized according to user requirements） | 90%Al2O3（black） | Gold plating |
| SWP1411 | CSP package | 1.4×1.1 | 0.16 | 95max（Customized according to user requirements） | 90%Al2O3（black） | Gold plating |
| SWP1109 | CSP package | 1.1×0.9 | 0.16 | 95max（Customized according to user requirements） | 90%Al2O3（black） | Gold plating |
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