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PRODUCTS
Our company has established "multi-layer ceramic package housing
development and production line"
Electronic ceramic products for communication
Electronic ceramics products for industrial laser
List for SAW base
basic information
Model | Packaging type |
Unit size (mm) |
Thickness dimension (mm) |
Array size (mm) |
Material | Plating layer |
SWP1814 | CSP package | 1.8×1.4 | 0.16 | 95max(Customized according to user requirements) | 90%Al2O3(black) | Gold plating |
SWP1411 | CSP package | 1.4×1.1 | 0.16 | 95max(Customized according to user requirements) | 90%Al2O3(black) | Gold plating |
SWP1109 | CSP package | 1.1×0.9 | 0.16 | 95max(Customized according to user requirements) | 90%Al2O3(black) | Gold plating |
On a
Crystal case list
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List for SAW base